Intel today opened the first 45nm Microprocessor Factory that will be responsible for the production of a new generation of microprocessors for PCs, laptops, servers and other computing devices.

Called “Fab 32,” the $3 billion factory will use Intel’s innovative 45nm process technology based on Intel’s breakthrough in “reinventing” certain areas of the transistors inside its processors to reduce energy leakage. The 45nm transistors use a Hafnium-based high-k material for the gate dielectric and metal materials for the gate, and are so small that more than 2 million can fit on the period at the end of this sentence. Millions of these tiny transistors will make up Intel’s faster, more energy efficient lead- and halogen-free processors for PCs, laptops and servers, as well as ultra low-power processors for mobile Internet and consumer electronic devices, and low-cost PCs. The first of the company’s 45nm processors is scheduled to be introduced on Nov. 12. (Via Intel)

Miles and miles of tracks make up the automated handling system that runs along the ceiling of Intel’s Fab 32 in Chandler, Ariz. Wafers are transported in front opening unified pods (or “FOUPs”) along these tracks from tool to tool as they go through Intel 45nm manufacturing process.

Intel’s 300mm 45nm wafers like the one shown here are used to make it’s newest dual and quad-core processors that are made up of hundreds of millions of the company’s new 45nm transistors with Hafnium-based high-k metal gate silicon technology.

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